Die Engineering Layouts And Formulas: A Reference Book Illustrating And Describing The Key Designs Of Punches And Dies Based On Presswork And Formulas

Die Engineering Layouts And Formulas: A Reference Book Illustrating And Describing The Key Designs Of Punches And Dies Based On Presswork And Formulas

$20.00 AUD

Availability: in stock at our Tullamarine warehouse

Condition: SECONDHAND

This is a secondhand book. The jacket image is a photograph of the exact copy we have in stock. This image shows the condition of this book. Further condition remarks are below.

Author: C. W. Hinman
Binding: Hardback
Published: McGraw-Hill Book Company, Inc., 1943

Condition:
Book: Good
Jacket: N/A
Pages: Good
Markings: No markings
Condition remarks: Tape markings on inside of binding, otherwise fine.

Die Engineering Layouts And Formulas presents a comprehensive guide to the intricate world of die design and manufacturing. This essential reference details the fundamental principles and advanced techniques required for precision engineering. It illustrates various layout strategies and provides critical formulas, equipping professionals and students with the knowledge to optimize production processes. The text instructs readers on practical applications, ensuring a thorough understanding of complex die engineering challenges.

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Description

Author: C. W. Hinman
Binding: Hardback
Published: McGraw-Hill Book Company, Inc., 1943

Condition:
Book: Good
Jacket: N/A
Pages: Good
Markings: No markings
Condition remarks: Tape markings on inside of binding, otherwise fine.

Die Engineering Layouts And Formulas presents a comprehensive guide to the intricate world of die design and manufacturing. This essential reference details the fundamental principles and advanced techniques required for precision engineering. It illustrates various layout strategies and provides critical formulas, equipping professionals and students with the knowledge to optimize production processes. The text instructs readers on practical applications, ensuring a thorough understanding of complex die engineering challenges.